
Inner layer Cu:1oz
Min track/gap 2.3mil/3mil
Min hole: 0.15mm
Board thickness: 1.2mm
Surface : ENIG
Material:FR4 IT-180A Tg:180
Specialty: 5-Steps HDI,Impedance Control
Laser Blind Hole:1-2,2-3,3-4,4-5,5-6,7-8,8-9,9-10,10-11,11-12.








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