8L 2-Steps Interconnected blind hole and burial hole Edge-plating ENIG
8L 2-Steps Interconnected blind hole and burial hole Edge-plating ENIG
Outer layer Cu:1oz
Inner layer Cu:1oz
Min track gap:3.5/3.5mil
Min hole: 0.1mm
Board thickness 1.05mm
Surface ENIG
Solder mask color:Green
Silkscreen:White
Material：FR4 S1000-2M Tg180
Specialty:2-Steps, Interconnected blind hole and burial hole,Impedance Control,Edge-plating.
Blind Hole1-2,1-3,6-8,7-8,6-7
Burial Hole:3-6
Inner layer Cu:1oz
Min track gap:3.5/3.5mil
Min hole: 0.1mm
Board thickness 1.05mm
Surface ENIG
Solder mask color:Green
Silkscreen:White
Material：FR4 S1000-2M Tg180
Specialty:2-Steps, Interconnected blind hole and burial hole,Impedance Control,Edge-plating.
Blind Hole1-2,1-3,6-8,7-8,6-7
Burial Hole:3-6
Quantity
