14L 6-Steps HDI(Arbitrary interconnection) ENIG EM390 Halogen-free
14L 6-Steps HDI(Arbitrary interconnection) ENIG EM390 Halogen-free
14L 6-Steps HDI(Arbitrary interconnection) ENIG EM390 Halogen-free
Outer layer Cu:25.4um
Inner layer Cu:20um
Min track/gap 1.8mil/2mil
Min hole: 0.1mm
Board thickness: 1.05mm
Surface : ENIG
Solder mask color:Green
Material：FR4 EM390( Halogen-free) Tg:180
Specialty: 6-Steps HDI, Impedance Control,Arbitrary interconnection
Laser Blind Hole:1-2,2-3,3-4,4-5,5-6,6-7,7-8,8-9,9-10,10-11,11-12.13-14
Outer layer Cu:25.4um
Inner layer Cu:20um
Min track/gap 1.8mil/2mil
Min hole: 0.1mm
Board thickness: 1.05mm
Surface : ENIG
Solder mask color:Green
Material：FR4 EM390( Halogen-free) Tg:180
Specialty: 6-Steps HDI, Impedance Control,Arbitrary interconnection
Laser Blind Hole:1-2,2-3,3-4,4-5,5-6,6-7,7-8,8-9,9-10,10-11,11-12.13-14
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